1. Mountin Position
Choose a mounting position that minimizes stress on the chip during board flexing or bending.
2. Allowable Soldering Temperature and Time
2-1 Solder within the temperature and time limits indicated by the slanted lines in the graphs below.
2-2 Excessive soldering conditions may lead to metallization dissolution or deterioration of solder-wetting on the external electrode.
2-3 For repeated soldering, ensure the total accumulated soldering time stays within the specified range. For instance, if the reflow peak temperature is 260℃, soldering twice should not exceed a total of 30 seconds at 260℃.
Optimal Temperature Profile for Soldering
3-1 Inadequate preheating can lead to ceramic body cracks. The temperature difference
between preheating and the profile’s maximum temperature should not exceed 100°C.
3-2 Avoid rapid cooling through solvent immersion or other methods.
*For repeated soldering, ensure the total soldering time falls within the range indicated in figure 2
4. Solder and Flux
4-1 Solder and PasteA) For reflow soldering of CT0201/0402/0603/0805 series components:
Use RA/RMA type solder paste or an equivalent.
B) For flow soldering of NCP0603/0805 series components:
We use the following solder paste for internal testing of this product:
Sn:Pb=63WT%:37%
Sn:Ag:Cu=96.5wt%:3.0wt%:0.5wt%
4-2 FluxUse rosin-based flux in the soldering process. Avoid using the following types of flux, as they may cause issues with product characteristics and reliability:
*Strongly acidic flux (with halide content exceeding 0.1wt%)
*Water-soluble flux
(Water-soluble flux includes non-rosin types like wash-type and non-wash-type fluxes.)
5. Cleaning Guidelines
When removing flux after soldering, follow these guidelines to prevent any degradation of characteristics or changes in the quality of external electrodes:
*Avoid subjecting mounted parts and the substrate to ultrasonic cleaning to prevent resonance.
*Do not clean products if a non-wash type flux has been used.
CT0201/0402 | CT0603/0805 | |
Solvent | Isopropyl alcohol | Isopropyl alcohol |
Dipping Cleaning | Less than 5 minutes at room temp. Or less than 2 minutes at 40℃ max. | Less than 5 minutes at room temp. Or less than 2 minutes at 40℃ max. |
Ultrasonic Cleaning | Less than 5 minutes and 20W/ℓ, Frequency of 28 to 40KHZ | Less than 5 minutes and 20W/ℓ, Frequency of several 10kHz to 100kHz |
6. Drying
After cleaning, promptly dry this product.
7. Solder Paste Printing Conditions
7-1 The solder amount is crucial. The standard height of the fillet is detailed in the table below.
7-2 Excessive soldering can induce mechanical stress, potentially leading to cracking and damage to both mechanical and electronic components.
Part No. | The solder paste Thickness | T |
CT0201 | 100um | 1/3E ≤ T ≤ E |
CT0402 | 150um | 1/3E ≤ T ≤ E |
CT0603/0805 | 200um | 0.2mm ≤ T ≤ E |
8. Applying Adhesive and Curing
8-1 Using a thin or insufficient amount of adhesive may cause components to become loose on lands during flow soldering.
8-2 Adhesive with low viscosity can lead to chips slipping after they have been mounted.
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